• 로그인 / 등록
  • Language
    • English
    • Deutsch
    • Française
    • Español
    • Português
    • Italia
    • Русский
    • 日本語
    • 한국어
    • 简体中文
    • 繁體中文

Winbond Electronics Corporation America

Winbond Electronics Corporation America
Winbond Electronics Corporation was established in September, 1987. The main business groups of Winbond include: DRAM Product, NOR Flash and Memory IC Manufacturing. Winbond headquarters in Central Taiwan Science Park, Taiwan and subsidies in America, Japan, and Hong Kong. As the Memory IC Company of excellence, Winbond strives to provide customer-driven memory solutions backed by the expert capabilities of product design, technology R&D, manufacturing, and sales services.
Winbond provides its partners with high-quality foundry services; meanwhile, manufactures Specialty DRAM, Mobile Memory and Flash Memory which are marketed under its own corporate brand name. With the optimizations of cost structure and capacity allocation, Winbond keeps pace with the latest technologies through good collaborations with international partners, ceaselessly achieves the long-term profitability and stable growth for the corporation. Professionalism and innovation are the main goals that Winbond continues pursuing.
At the same time, Winbond provides comprehensive training courses, a continuously improving employee-benefit system, and employment opportunities based on performance. Winbond received the Friendly Workplace Award from the Executive Yuan’s Council of Labor Affairs in Taiwan.

목록

  • W25X40CLSSIG TR
    W25X40CLSSIG TR
    Winbond
    IC FLASH 4M SPI 104MHZ 8SOIC
    8-SOIC (0.209, 5.30mm Width)
  • W25X40CLSNIG TR
    W25X40CLSNIG TR
    Winbond
    IC FLASH 4M SPI 104MHZ 8SOIC
    8-SOIC (0.154, 3.90mm Width)
  • W25Q80DLSNIG
    W25Q80DLSNIG
    Winbond
    IC FLASH 8M SPI 104MHZ 8SOIC
    8-SOIC (0.154, 3.90mm Width)
  • W25Q64JVSSIQ
    W25Q64JVSSIQ
    Winbond
    NOR Flash spiFlash, 64M-bit, DTR, 4Kb Uniform Sector
    SOP-8
  • W25P16VSSIG T&R
    W25P16VSSIG T&R
    Winbond
    IC FLASH 16MBIT 50MHZ 8SOIC
    SOIC-8
  • W25P16VSFIG T&R
    W25P16VSFIG T&R
    Winbond
    IC FLASH 16MBIT 50MHZ 16SOIC
    SOIC-16
  • W25P10VSNIG T&R
    W25P10VSNIG T&R
    Winbond
    IC FLASH 1MBIT 40MHZ 8SOIC
    SOIC-8
  • W25N01GVZEIT TR
    W25N01GVZEIT TR
    Winbond
    IC FLASH 1GBIT NAND WSON
    8-WDFN Exposed Pad
  • W25N01GVZEIG TR
    W25N01GVZEIG TR
    Winbond
    IC FLASH 1GBIT NAND WSON
    8-WDFN Exposed Pad
  • W25M512JVFIQ TR
    W25M512JVFIQ TR
    Winbond
    SPIFLASH 512M-BIT 4KB UNIFORM SE
    16-SOIC (0.295, 7.50mm Width)
  • W25M512JVFIQ
    W25M512JVFIQ
    Winbond
    SPIFLASH 512M-BIT 4KB UNIFORM SE
    16-SOIC (0.295, 7.50mm Width)
  • W25M512JVEIQ TR
    W25M512JVEIQ TR
    Winbond
    SPIFLASH 512M-BIT 4KB UNIFORM SE
    8-WDFN Exposed Pad
  • W25M512JVCIQ TR
    W25M512JVCIQ TR
    Winbond
    IC FLASH 512MBIT 4KB 24TFBGA
    24TFBGA
  • W25M512JVCIQ
    W25M512JVCIQ
    Winbond
    IC FLASH 512MBIT 4KB 24TFBGA
    24TFBGA
  • W25M02GVZEIT TR
    W25M02GVZEIT TR
    Winbond
    IC FLASH 2GBIT NAND WSON
    8-WDFN Exposed Pad
  • W25M02GVZEIG TR
    W25M02GVZEIG TR
    Winbond
    IC FLASH 2GBIT NAND WSON
    8-WDFN Exposed Pad
  • W25M02GVTCIT TR
    W25M02GVTCIT TR
    Winbond
    IC FLASH 2GBIT NAND 24TFBGA
    24TFBGA
  • W25M02GVTCIG TR
    W25M02GVTCIG TR
    Winbond
    IC FLASH 2GBIT NAND 24TFBGA
    24TFBGA
  • W25M02GVTBIT TR
    W25M02GVTBIT TR
    Winbond
    IC FLASH 2GBIT NAND 24TFBGA
    24TFBGA
  • W25M02GVTBIG TR
    W25M02GVTBIG TR
    Winbond
    IC FLASH 2GBIT NAND 24TFBGA
    24TFBGA
  • W25B40VSNIG T&R
    W25B40VSNIG T&R
    Winbond
    IC FLASH 4MBIT 40MHZ 8SOIC
    SOIC-8
  • W25B40AVSNIG T&R
    W25B40AVSNIG T&R
    Winbond
    IC FLASH 4MBIT 40MHZ 8SOIC
    SOIC-8
  • W24257S-70LL T/R
    W24257S-70LL T/R
    Winbond
    IC SRAM 256KBIT 70NS 28SOP
    28SOP
  • 25X20AVSNIG
    25X20AVSNIG
    WINBOND
    IC FLASH 2MBIT 100MHZ 8SOIC
    8-SOIC (0.154", 3.90mm Width)

귀하의 위치를 ​​선택하십시오