Jiangsu Changjiang Electronics Technology Co., Ltd.(JCET) was established in 1972, and in 2003 it was successfully listed on the main board of the Shanghai Stock Exchange. After more than forty years of development, JCET has become the largest IC packaging and testing company in China and the third largest in the world.
The company provides global customers with packaging design, product development and certification, with a full range of services including semiconductor design, wafer probe, bump, packaging, test and drop shipment.
The company has an extensive portfolio of technology and solutions, including the intellectual property (IP) rights of Fan-out embedded Wafer Level Ball Grid Array (eWLB), wafer level chip scale packaging (WLCSP), wafer bump, Package-on-Package (PoP), flip chip Ball Grid Array (fcBGA), System-in-Package (SiP), and other leading technologies.
